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Title:
LAMINATING TYPE INDUCTOR AND METHOD OF MANUFACTURING THEREOF
Document Type and Number:
WIPO Patent Application WO/2011/148787
Kind Code:
A1
Abstract:
Provided is a laminating type inductor and a method of manufacturing thereof, wherein a proximity effect by coil conductors in the high frequency range can be alleviated, and the Q value thereof can also be improved. In a laminating type inductor (10) provided with a coil (4) that is formed within a laminate (5), which comprises a plurality of nonmagnetic material layers (1) and a plurality of coil conductors (2) laminated with the nonmagnetic material layers interposed therebetween, by having the coil conductors inter-layer connected, magnetic material layers (3) are arranged on faces (12) of the coil conductors that face each other with the nonmagnetic material layers interposed therebetween. Magnetic material layers are also arranged around the coil conductors so as to cover the whole outer circumference faces of the coil conductors. The magnetic material layers are to be comprised of a metal the main component of which is nickel. The magnetic material layers are formed by having a magnetic material paste, the main component of which is nickel, baked at the same time as when the nonmagnetic material layers and the coil conductor patterns are baked. The magnetic material layers are also formed by forming a plating film, the main component of which is nickel, around the coil conductors by plating.

Inventors:
MAEDA, Yukio (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2011/060841
Publication Date:
December 01, 2011
Filing Date:
May 11, 2011
Export Citation:
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Assignee:
MURATA MANUFACTURING CO.,LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
株式会社村田製作所 (〒55 京都府長岡京市東神足1丁目10番1号 Kyoto, 〒6178555, JP)
International Classes:
H01F17/00; H01F41/04
Domestic Patent References:
WO2009133766A1
Foreign References:
JPH11121237A
JP2007214341A
JPH0883715A
JPH04317302A
Attorney, Agent or Firm:
NISHIZAWA, Hitoshi (5th Floor, Daido Seimei Minami-kan 1-2-11, Edobori, Nishi-ku, Osaka-sh, Osaka 02, 〒5500002, JP)
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Claims: