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Patent Searching and Data


Title:
LAMINATION DEVICE, AND LAMINATION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/029493
Kind Code:
A1
Abstract:
Provided are a lamination device and lamination method which reduce warping in a transparent substrate constituting a workpiece, which can reduce the lamination time, and which can maintain at least a predetermined product quality, even when more than one workpiece is simultaneously delivered to one lamination device and laminated. In a lamination device (100) which has an upper chamber (113) partitioned by a diaphragm (112) and a lower chamber (121) provided with a heat plate (122), and which delivers a workpiece (10) by a conveyance sheet (130) which travels over the heat plate, the heat plate is provided with a lifting member (400). The lamination device is configured so that when the workpiece is delivered into a lamination section (101), the lifting member (400) is raised, and the conveyance sheet travels raised from the heat plate, and when the workpiece on the conveyance sheet is delivered to a predetermined position above the heat sheet, the lifting member (400) is lowered, the workpiece is placed on the heat sheet, and is laminated.

Inventors:
YUFU ATSUSHI (JP)
SHINODA TAKASHI (JP)
SAKAKIBARA KATSUYUKI (JP)
TAKAGI YASUSHI (JP)
Application Number:
PCT/JP2011/067812
Publication Date:
March 08, 2012
Filing Date:
July 28, 2011
Export Citation:
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Assignee:
NISSHINBO MECHATRONICS INC (JP)
YUFU ATSUSHI (JP)
SHINODA TAKASHI (JP)
SAKAKIBARA KATSUYUKI (JP)
TAKAGI YASUSHI (JP)
International Classes:
B29C63/02; B29C65/02; B29C65/78; H01L31/042; B29L9/00
Foreign References:
JP2008126407A2008-06-05
JPH0337201U1991-04-11
JP2006035789A2006-02-09
JP2010192638A2010-09-02
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Claims: