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Patent Searching and Data


Title:
LAMINATION DEVICE AND LAMINATION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/190209
Kind Code:
A1
Abstract:
In order to provide a lamination device and a lamination method by which a resin film can be made to completely follow irregularities on a substrate even if the irregularities on the substrate include pointed parts, this lamination device is provided with: a conveying means for conveying a temporarily laminated body comprising a substrate having irregularities, with a resin film made from a thermosetting resin in a B-stage state placed on the irregular surface of the substrate; a sealed space forming means for accommodating the conveyed temporarily laminated body; a negative pressure forming means for generating a negative pressure in a sealed space formed by the sealed space forming means; and a heating means for heating the temporarily laminated body from the substrate side thereof, in the sealed space in the negative pressure state, to soften the resin film. The sealed space in the negative pressure state is set to ambient pressure or is pressurized, and the resin film which has been softened in a non-contact state is caused to adhere along the irregularities of the substrate to form a final laminated body from the temporarily laminated body.

Inventors:
IWATA KAZUTOSHI (JP)
HONMA YOSHIAKI (JP)
Application Number:
PCT/JP2016/064854
Publication Date:
December 01, 2016
Filing Date:
May 19, 2016
Export Citation:
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Assignee:
NIKKO-MATERIALS CO LTD (JP)
International Classes:
B29C63/00; B29C51/10; B29C63/40
Foreign References:
JP5334135B22013-11-06
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
Masahiko Nishifuji (JP)
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