Title:
LAMINATION FILM, LAMINATED FILM, AND PACKAGING
Document Type and Number:
WIPO Patent Application WO/2021/014966
Kind Code:
A1
Abstract:
The present invention aims to provide a lamination film that has suitable seal strength and heat resistance and is capable of creating highly visible peeling marks after a lid material has been peeled off. This lamination film has at least a heat seal layer and a support layer provided on one side of the heat seal layer and is characterized by: a first resin composition, which forms the heat seal layer, including a high density polyethylene (a), a propylene-based random copolymer (b), and a 1-butene-based polymer (c); the (a) component content being 30%–60% by mass; the (b) component content being 8%–42% by mass; the (c) component content being 16%–56% by mass; the melt flow rate for the (a) component at 190°C being 10–30 g/10 mins; the melt flow rate for the (b) component at 230°C being 8–20 g/10 mins; and the melt flow rate for the (c) component at 190°C being 0.3–3 g/10 mins.
Inventors:
MORIYA TAKASHI (JP)
KIDA TOMOHISA (JP)
KIDA TOMOHISA (JP)
Application Number:
PCT/JP2020/026615
Publication Date:
January 28, 2021
Filing Date:
July 07, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/32; B65D65/40
Domestic Patent References:
| WO2004067626A1 | 2004-08-12 | |||
| WO2015005279A1 | 2015-01-15 |
Foreign References:
| JP2011099111A | 2011-05-19 |
Attorney, Agent or Firm:
AWANO Haruo (JP)
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