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Patent Searching and Data


Title:
LAMINATION MEMBER AND GLASS COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/158457
Kind Code:
A1
Abstract:
The present invention pertains to a lamination member that includes: a glass member having, at a wavelength of 850 nm, a linear transmittance within a predetermined range; a bonding layer disposed on the glass member and containing a resin; and an Si-SiC member disposed on the bonding layer. The glass member contains, at predetermined amounts, SiO2, Al2O3, B2O3, and P2O5. The average linear expansion coefficient α of the Si-SiC member at 20-200°C, the average linear expansion coefficient β of the glass member at 20-200°C, and an absolute value |α-β| obtained by subtracting β from α, are within predetermined ranges.

Inventors:
HANAWA YU (JP)
OGAWA SHUHEI (JP)
INABA SEIJI (JP)
Application Number:
PCT/JP2022/001654
Publication Date:
July 28, 2022
Filing Date:
January 18, 2022
Export Citation:
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Assignee:
AGC INC (JP)
International Classes:
C03C27/00; B32B7/023; B32B7/027; B32B9/00; B32B9/04; B32B17/10; B32B27/06; C03C3/091; C03C3/097; C04B37/00; C04B37/04
Domestic Patent References:
WO2015087812A12015-06-18
WO2021251247A12021-12-16
WO2021015059A12021-01-28
Foreign References:
JPH0388783A1991-04-15
JP2008199006A2008-08-28
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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