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Patent Searching and Data


Title:
LAMINATION METHOD AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2014/132764
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a lamination method with which high membrane thickness precision can be obtained by reducing variations in substrate membrane thickness, the method being highly versatile and capable of limiting cost increases; and a laminate. This lamination method comprises a gluing process for conveying a substrate and a support with specified conveyance paths and gluing the support to the main surface of the substrate, and a curing process for curing the adhesive after the gluing process. The gluing process glues the substrate to the support by passing same successively between two or more pairs of nip rollers. The two or more pairs of nip rollers are set so that the nip distance of the pair of nip rollers disposed on the downstream side is equal to or less than the nip distance of nip rollers disposed on the upstream side.

Inventors:
SATO HIROSHI (JP)
SHINOZUKA TOMOYUKI (JP)
Application Number:
PCT/JP2014/052695
Publication Date:
September 04, 2014
Filing Date:
February 05, 2014
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B25/04; B29C65/48; B32B27/00; C09J5/00; C09J201/00
Domestic Patent References:
WO2012043674A12012-04-05
Foreign References:
JP2004268447A2004-09-30
JPS6013528A1985-01-24
JP2006159723A2006-06-22
JP2006051717A2006-02-23
JP4368654B22009-11-18
JP4739558B22011-08-03
JP2009279909A2009-12-03
JP4601918B22010-12-22
JP4989787B22012-08-01
JPH06315980A1994-11-15
Other References:
NIPPON GOMU KYOKAISHI, vol. 68, 1995, pages 76 - 85,108-118
NIPPON GOMU KYOKAISHI, vol. 69, 1996, pages 375 - 383
I. SKEIST: "Handbook of Adhesives, 2ND ED.", 1977
See also references of EP 2962835A4
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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