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Patent Searching and Data


Title:
LAPPING DECORATIVE BOARD AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2019/131026
Kind Code:
A1
Abstract:
Provided is a lapping decorative board (A) comprising a plate-shaped substrate (1) and a decorative sheet layer (20) composed of a sheet (20') that is adhered to and integrated with a surface (1a) and a circumferential side of the substrate (1) so that the peripheral portion is positioned on the circumferential side of the substrate (1), wherein the decorative sheet layer (20) has a surface portion (20a) adhered to the surface (1a) of the substrate (1), side surface portions (20b, 20b) and end surface portions (20c, 20c) adhered to the peripheral side surface of the substrate (1), and an in-groove surface portion (20d) adhered to the inner surface of a groove (3), and the two end surfaces (20c, 20c) on which the ends of the groove (3) of the decorative sheet layer (20) are provided are divided into two by a cut (C1) extending from the position corresponding to the bottom of the groove (3) to the edge of the sheet (20').

Inventors:
ITO Tatsuya (1-1 Inami, Nanto-cit, Toyama 98, 〒9320298, JP)
NAKAO Kiminori (1-1 Inami, Nanto-cit, Toyama 98, 〒9320298, JP)
Application Number:
JP2018/044777
Publication Date:
July 04, 2019
Filing Date:
December 05, 2018
Export Citation:
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Assignee:
DAIKEN CORPORATION (1-1 Inami, Nanto-city Toyama, 98, 〒9320298, JP)
International Classes:
B32B3/00; B27D5/00
Foreign References:
JP2008279717A2008-11-20
JPH02188205A1990-07-24
JPH02188204A1990-07-24
JPH02188203A1990-07-24
JP2009184305A2009-08-20
JP2017124554A2017-07-20
Attorney, Agent or Firm:
MAEDA & PARTNERS (Shin-Daibiru Bldg. 23F, 2-1 Dojimahama 1-chome, Kita-ku, Osaka-sh, Osaka 04, 〒5300004, JP)
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