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Patent Searching and Data


Title:
LAPPING TOOL
Document Type and Number:
WIPO Patent Application WO/2002/058889
Kind Code:
A1
Abstract:
A lapping tool capable of increasing the accuracy of a lapping operation, extending the life of a lapping tool itself, adjusting a lapping diameter, and coping with the lapping operation of various diameters, comprising a lapping tool body having a lapping part on the outer peripheral surface thereof and slits provided in the lapping tool body axially between the tip part and the base part thereof.

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Inventors:
Senjo, Motohiro c/o SENJO SEIKI CORPORATION 622-7 (Shishihara Shimizu-shi, Shizuoka, 424-0301, JP)
Application Number:
PCT/JP2002/000238
Publication Date:
August 01, 2002
Filing Date:
January 16, 2002
Export Citation:
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Assignee:
SENJO SEIKI CORPORATION (622-7, Shishihara Shimizu-Shi, Shizuoka, 424-0301, JP)
Senjo, Motohiro c/o SENJO SEIKI CORPORATION 622-7 (Shishihara Shimizu-shi, Shizuoka, 424-0301, JP)
International Classes:
B23G1/36; B23D77/08; B24B33/08; B24D7/18; (IPC1-7): B24D7/18; B23D77/08; B23F21/02; B24B33/08
Foreign References:
JPS50110897U
JPS6281559U
US4099350A
JPH1158246A
JP3005414U
JP3016312U
JPS6360561U
JPS637265A
JP2000343327A
Other References:
See also references of EP 1366861A1
Attorney, Agent or Firm:
Shimano, Yoshiichi (Chisan Mansion Kouyamachi Room No.203 11-6, Kouyamachi Shizuoka-shi, Shizuoka, 420-0852, JP)
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