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Patent Searching and Data


Title:
LASER ANNEALING DEVICE AND LASER ANNEALING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/061126
Kind Code:
A1
Abstract:
Provided is a laser annealing device provided with an irradiation unit in which a plurality of lens arrays each comprising one or more lenses are arranged at a first interval, wherein, while scanning a substrate having: a plurality of first area arrays each of which comprises one or more areas to be irradiated and which are arranged at the first interval; and a plurality of second area arrays which are arranged apart from the first area arrays toward one side in a direction orthogonal to the first area arrays by a second interval smaller than the first interval, the irradiation unit irradiates the areas to be irradiated with a laser beam through the one or more lenses. At least one type of area array, in one pixel unit row that comprises a plurality of area arrays including the first and second area arrays, is irradiated with a laser by use of a lens array different from the ones used for the other types of area arrays.

Inventors:
NAKAGAWA, Hidetoshi (1 Takumicho, Sakai-ku, Sakai-sh, Osaka 22, 〒5908522, JP)
Application Number:
JP2016/078714
Publication Date:
April 05, 2018
Filing Date:
September 28, 2016
Export Citation:
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Assignee:
SAKAI DISPLAY PRODUCTS CORPORATION (1 Takumicho, Sakai-ku Sakai-sh, Osaka 22, 〒5908522, JP)
International Classes:
H01L21/268; H01L21/20; H01L21/336; H01L29/786
Foreign References:
JP2011233597A2011-11-17
JP2012243818A2012-12-10
US20040134417A12004-07-15
JP3945805B22007-07-18
JP2008227077A2008-09-25
JP2011100838A2011-05-19
Attorney, Agent or Firm:
KOHNO, Hideto et al. (KOHNO & KOHNO, 4-3 Tsuriganecho 2-chome, Chuo-ku, Osaka-sh, Osaka 35, 〒5400035, JP)
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