Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER-ASSISTED METHOD FOR PARTING CRYSTALLINE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/136622
Kind Code:
A3
Abstract:
A method for processing a crystalline substrate to form multiple patterns of subsurface laser damage facilitates subsequent fracture of the substrate to yield first and second substrate portions of reduced thickness. Multiple groups of parallel lines of multiple subsurface laser damage patterns may be sequentially interspersed with one another, with at least some lines of different groups not crossing one another. Certain implementations include multiple subsurface laser damage patterns with groups of parallel lines that are non-parallel to one another, but each line is within ±5 degrees of perpendicular to the <1120> direction of a hexagonal crystal structure of a material of the substrate. Further methods involve formation of initial and subsequent subsurface laser damage patterns that are centered at different depths within of a substrate, with the laser damage patterns being registered and having vertical extents that are overlapping.

Inventors:
DONOFRIO MATTHEW (US)
EDMOND JOHN (US)
GOLAKIA HARSHAD (US)
Application Number:
IB2019/061410
Publication Date:
November 26, 2020
Filing Date:
December 27, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
CREE INC (US)
International Classes:
B23K26/53; B23K26/06; H01L21/02; B23K101/40; B23K103/00
Foreign References:
US20160158881A12016-06-09
US20170291255A12017-10-12
US20170014944A12017-01-19
US20110312115A12011-12-22
US20180154543A12018-06-07
US20180290232A12018-10-11
Attorney, Agent or Firm:
GUSTAFSON, Vincent K. (US)
Download PDF: