Title:
LASER BASED SYSTEM FOR CUTTING TRANSPARENT AND SEMI-TRANSPARENT SUBSTRATES
Document Type and Number:
WIPO Patent Application WO/2020/098660
Kind Code:
A1
Abstract:
A system for efficiently cutting a transparent substrate. The system includes a laser source (32) in optical communication with at least one multi-foci optical system. The laser source (32) outputs at least one optical signal (34) to the optical system. The optical system is positioned between the laser source (32) and the substrate (50) to be cut. The optical system includes at least one housing (70) detachably coupled to at least one base member (72). One or more plate members (74) having one or more apertures (76) formed therein may be coupled to at least one of the housing (70), the baser member (72), or both. The aperture (76) formed on the plate member (74) may be configured to permit the optical signal to enter and exit the optical system. Various optical subassemblies may be positioned within or coupled to the optical system.
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Inventors:
MIAO CHENG-HSI (US)
Application Number:
PCT/CN2019/117717
Publication Date:
May 22, 2020
Filing Date:
November 12, 2019
Export Citation:
Assignee:
VERTILED CO LTD (CN)
International Classes:
B23K26/046
Foreign References:
| CN108161250A | 2018-06-15 | |||
| CN102380709A | 2012-03-21 | |||
| CN107214420A | 2017-09-29 | |||
| CN107030401A | 2017-08-11 | |||
| CN104570363A | 2015-04-29 | |||
| KR20160107603A | 2016-09-19 |
Attorney, Agent or Firm:
YONG HUI INTELLECTUAL PROPERTY (CN)
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