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Patent Searching and Data


Title:
LASER BEAM MACHINING SYSTEM AND LASER BEAM MACHINING METHOD USING THE SAME
Document Type and Number:
WIPO Patent Application WO2001062431
Kind Code:
A3
Abstract:
The object of this invention is to provide a laser beam machining system and a laser beam machining method, wherein the working environment for the laser beam machining in the safety cabin is not impaired, and carrying out of the machined work can be performed without causing a shift of the machined work on the machining table, and also, without the laser beam machining being suspended, thereby enabling improvement in the productivity. At least one carriage of two, first and second carriages (11), (19) placed in a safety cabin (29) is moved back and forth above a machining table, and a laser machining head provided in that carriage is moved right and left, to thereby perform laser beam machining with respect to a work (W) on a machining table (7 or 9). The second carriage is moved back and forth above the machining table (7 or 9), so that a holding device (25) provided in the second carriage is moved right and left, to thereby hold and carry the machined work (W). Features of double carriages (11, 19) in the safety cabin (29) can be fully utilized, enabling improvement in the productivity.

Inventors:
EGASHIRA ICHIRO (JP)
Application Number:
PCT/JP2001/001487
Publication Date:
January 31, 2002
Filing Date:
February 28, 2001
Export Citation:
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Assignee:
AMADA CO LTD (JP)
EGASHIRA ICHIRO (JP)
International Classes:
B23K26/10; B23K37/00; F16P1/06; B23Q7/04; (IPC1-7): B23K26/08; B23K26/12; F16P1/06
Foreign References:
US4659902A1987-04-21
Other References:
PATENT ABSTRACTS OF JAPAN vol. 009, no. 226 (M - 412) 12 September 1985 (1985-09-12)
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31)
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