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Patent Searching and Data


Title:
LASER BONDED STRUCTURE, ELECTRONIC CONTROL DEVICE, AND METHOD FOR PRODUCING LASER BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/056427
Kind Code:
A1
Abstract:
This laser bonded structure is obtained by laser bonding a metal body that is formed of a metal and a resin molded body that is formed of a thermoplastic polymer alloy that is alloyed and contains a crystalline resin and an amorphous resin. The glass transition temperature of the amorphous resin is lower than the melting initiation temperature of the crystalline resin.

Inventors:
ARAI SATOSHI (JP)
TSUNODA SHIGEHARU (JP)
SAWADA WATARU (JP)
KAMOSHIDA MASARU (JP)
SHIGYO TOSHIKAZU (JP)
Application Number:
PCT/JP2015/077503
Publication Date:
April 14, 2016
Filing Date:
September 29, 2015
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
B29C65/16; B23K26/21; B23K26/324; H05K5/02; H05K5/06
Domestic Patent References:
WO2014123022A12014-08-14
Foreign References:
JP2011052223A2011-03-17
Other References:
See also references of EP 3205480A4
Attorney, Agent or Firm:
NAGAI, Fuyuki (JP)
Fuyuki Nagai (JP)
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