Title:
LASER BONDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/080059
Kind Code:
A1
Abstract:
An embodiment according to the present invention relates to a laser bonding apparatus for connecting a first electrode of a first substrate and a second electrode of a second substrate by using a conductive film, the laser bonding apparatus comprising: a pressing unit for pressing the first electrode, a conductive film disposed on the first electrode, and the second electrode disposed on the conductive film; a laser irradiation unit for radiating a laser beam to the first electrode, the conductive film disposed on the first electrode, and the second electrode disposed on the conductive film, so as to heat the same; and a control unit for sequentially driving the pressing unit and the laser irradiation unit, wherein the control unit primarily drives the pressing unit and secondarily drives the laser irradiation unit for two hours after one hour has elapsed.
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Inventors:
PARK GUN WOO (KR)
KIM KYUNG SOO (KR)
TO HYUN GU (KR)
KIM KYUNG SOO (KR)
TO HYUN GU (KR)
Application Number:
PCT/KR2017/011277
Publication Date:
May 03, 2018
Filing Date:
October 13, 2017
Export Citation:
Assignee:
DE & T CO LTD (KR)
International Classes:
B23K26/20; B23K26/32; B23K26/60; B23K26/70; B23K37/04; B23K101/36
Foreign References:
| JP2006253665A | 2006-09-21 | |||
| JPH049821A | 1992-01-14 | |||
| JP2012079807A | 2012-04-19 | |||
| KR20080040151A | 2008-05-08 | |||
| KR20050042582A | 2005-05-10 |
Attorney, Agent or Firm:
WELL PATENT LAW FIRM (KR)
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