Title:
LASER BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/020531
Kind Code:
A1
Abstract:
Provided is a laser bonding method that is a highly reliable method for laser bonding a thermoplastic resin and a metal, in which the peeling associated with thermal stress during bonding is controlled by improving interface adhesion between the thermoplastic resin and the metal. The laser bonding method comprises a step in which, prior to bonding, an oxidation layer having a high oxygen functional group content compared to a bulk thermoplastic resin is formed on at least the bonding interface side of the thermoplastic resin by means of surface modification treatment. The thermoplastic resin and metal are bonded by the application of pressure and laser irradiation in a state in which the surface energy of the metal at the bonding surface is higher than the surface energy of the thermoplastic resin on which the oxidation layer has been formed.
Inventors:
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
HYUGANO TAKESHI (JP)
Application Number:
PCT/JP2011/003692
Publication Date:
February 16, 2012
Filing Date:
June 29, 2011
Export Citation:
Assignee:
HITACHI LTD (JP)
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
International Classes:
B29C65/16; B23K26/32; B23K26/352
Foreign References:
| JP2010046831A | 2010-03-04 | |||
| JP2010076437A | 2010-04-08 | |||
| JP2006015405A | 2006-01-19 | |||
| JP2009173023A | 2009-08-06 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
Download PDF:
Claims: