LASER CUTTING HEAD FOR CUTTING HARD, BRITTLE PRODUCT AND LASER CUTTING DEVICE

Title:

LASER CUTTING HEAD FOR CUTTING HARD, BRITTLE PRODUCT AND LASER CUTTING DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/154985

Kind Code:

A1

Abstract:

A laser cutting head for cutting a hard, brittle product (10). The laser cutting head comprises a polarizing element (1), a binary phase element (2), and a focusing element (3) arranged in sequence. A laser beam passes through the polarizing element (1) to form a polarized laser beam. The polarized laser beam is then directed to the binary phase element (2), and forms a diffracted laser beam at the binary phase element (2). The diffracted laser beam is then directed to the focusing element (3), and forms a focused laser beam at the focusing element (3) for cutting the hard, brittle product (10). Also disclosed is a laser cutting device. The laser beam sequentially passes through the polarizing element, the binary phase element, and the focusing element to be finally converted into a focused laser beam having a long focal depth and exhibiting a uniform variation in peak power density, thus enabling penetration into the hard, brittle product, and achieving cutting of said product in an ideal manner.

Inventors:

ZHANG XIAOJUN (CN)
YUAN XUERUI (CN)
YU PINGPING (CN)
LU JIANGANG (CN)
YIN JIANGANG (CN)
GAO YUNFENG (CN)

Application Number:

PCT/CN2019/074007

Publication Date:

August 06, 2020

Filing Date:

January 30, 2019

Export Citation:

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Assignee:

HAN'S LASER TECH INDUSTRY GROUP CO LTD (CN)

International Classes:

B23K26/00; B23K26/06; B23K26/38

Foreign References:

CN102642092A	2012-08-22
JP2010188370A	2010-09-02
CN108515273A	2018-09-11
CN103091859A	2013-05-08
DE102012208527A1	2013-02-07

Other References: