LASER CUTTING MACHINE, CORRECTION VALUE COMPUTING DEVICE, AND PROGRAM

WIPO Patent Application WO/2017/199410

A1

A laser cutting machine (1) irradiates a target object (W) with laser light (L) to cut the target object (W) and form a cutting surface (CS) on the target object (W). The laser cutting machine (1) includes a target object support unit (10) that supports the target object (W), a cutting head (20) that irradiates the target object (W) with laser light (L), and a relative movement unit (30) that can move the cutting head (20) in the X direction, Y direction, and Z direction. The laser cutting machine (1) includes a contact detection unit (50) that detects contact of the target object (W) with the cutting head (20), and a control device (40) that uses the cutting surface (CS) to compute a tool diameter correction value during cutting. The control device (40) computes the tool diameter correction value on the basis of cutting-time position information that indicates a position of the cutting head (20) when the cutting surface (CS) is formed on the target object (W) and on the basis of contact-time position information that indicates a position of the cutting head (20) when the cutting head (20) contacts the cutting surface (CS).

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YAMAMOTO HIBIKI (JP)
MIYAZAKI TAKANORI (JP)

PCT/JP2016/064943

November 23, 2017

May 19, 2016

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MITSUBISHI ELECTRIC CORP (JP)

B23K26/38; B23K26/02; B23K26/08

JPH10258384A	1998-09-29
JPH03155484A	1991-07-03
JP2002001568A	2002-01-08
JP2003126980A	2003-05-08
JPH06161523A	1994-06-07

TAKAMURA, Jun (JP)

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