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Title:
LASER CUTTING MACHINE
Document Type and Number:
WIPO Patent Application WO/2011/004509
Kind Code:
A1
Abstract:
A laser cutting machine (1) comprises a retainer mechanism (2) which immovably holds a substrate (9) with a surface to be machined facing upward, a machining nozzle (3) which is moved in the Y-axis direction to irradiate the laser beam onto the surface of the substrate (9) to be machined and which is movable also in the X-axis direction, a dust collection nozzle (5) which is moved in the Y-axis direction in association with the movement of the machining nozzle (3), and a support mechanism (4) which supports the substrate (9) from below and which is movable in the X-axis direction relative to the substrate (9). In the laser cutting machine (1), the substrate (9) is not moved during laser cutting, and the laser cutting is performed while moving the machining nozzle (3) and the dust collection nozzle (5) to suck dust produced from the cutting portion upon which the laser beam is irradiated. Also, when the machining nozzle 3 is moved in the X-axis direction by pitch-feeding, the support mechanism (4) is moved in the X-axis direction to prevent interference between the support mechanism (4) and the laser beam axis.

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Inventors:
MATSUMOTO JUNICHI (JP)
NISHI NORIO (JP)
TAKEDA NOBUYUKI (JP)
YAMAGISHI NORIHIRO (JP)
SUZUKI MASAMI (JP)
Application Number:
PCT/JP2009/067453
Publication Date:
January 13, 2011
Filing Date:
October 07, 2009
Export Citation:
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Assignee:
KATAOKA CORP (JP)
MATSUMOTO JUNICHI (JP)
NISHI NORIO (JP)
TAKEDA NOBUYUKI (JP)
YAMAGISHI NORIHIRO (JP)
SUZUKI MASAMI (JP)
International Classes:
B23K26/10; B23K26/142; B23K26/36
Foreign References:
JP2009142834A2009-07-02
JP2008290123A2008-12-04
JP2007021574A2007-02-01
JP2002254183A2002-09-10
JPH0619990U1994-03-15
JP2000343268A2000-12-12
JP2000246478A2000-09-12
JP2001085720A2001-03-30
JPH04231538A1992-08-20
Other References:
See also references of EP 2452774A4
Attorney, Agent or Firm:
AKAZAWA, Kazuhiro (JP)
Kazuhiro Akazawa (JP)
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