Title:
LASER CUTTING PROCESSING METHOD FOR BRITTLE MATERIALS
Document Type and Number:
WIPO Patent Application WO/2020/130165
Kind Code:
A1
Abstract:
The present invention relates to a laser cutting processing method for brittle materials, which heats, by means of a high power laser beam, the inside of brittle non-metal materials such as sapphire, silicone, and an SiC wafer and immediately cools the brittle non-metal materials so as to generate a thermal shock while preventing melting, cracks, or micropores from being generated in the inside of the brittle non-metal materials, such that an object to be processed can be cut not only in a crystal direction but also in an arbitrary and desired direction which is not the crystal direction.
Inventors:
LEE SEAKJOON (KR)
Application Number:
PCT/KR2018/016062
Publication Date:
June 25, 2020
Filing Date:
December 18, 2018
Export Citation:
Assignee:
LEE SEAKJOON (KR)
International Classes:
H01L21/78; B23K26/38; H01L21/67; H01L21/76; B23K103/00
Foreign References:
| KR100302825B1 | 2001-12-01 | |||
| KR101119289B1 | 2012-03-15 | |||
| KR100958745B1 | 2010-05-19 | |||
| KR100794284B1 | 2008-01-11 | |||
| JP2009066613A | 2009-04-02 |
Attorney, Agent or Firm:
PARK, Junghak (KR)
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