Title:
LASER CUTTING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2016/088494
Kind Code:
A1
Abstract:
The objective of the invention is to prevent the position of a workpiece from becoming displaced when the workpiece is lifted from a pallet using a fork unit, and to prevent interference when the product or the remaining material is subsequently picked up. Provided is a laser cutting system (100) comprising: a processing machine body (10) which subjects a workpiece (W) to laser processing; a fork unit (30) which can be raised and lowered, and on which the workpiece (W) which has been withdrawn from the processing machine body (10) is placed; and a fork supporting unit (40) which supports distal ends (32a) of the fork unit (30), and which is raised and lowered synchronously with the raising and lowering of the fork unit (30).
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Inventors:
HOTTA YOSHIO (JP)
Application Number:
PCT/JP2015/080799
Publication Date:
June 09, 2016
Filing Date:
October 30, 2015
Export Citation:
Assignee:
MURATA MACHINERY LTD (JP)
International Classes:
B23K26/38; B23K26/10; B23K26/70; B23Q7/00
Domestic Patent References:
| WO2014115448A1 | 2014-07-31 |
Foreign References:
| JP2014018817A | 2014-02-03 | |||
| JP2001105169A | 2001-04-17 | |||
| JPH0852575A | 1996-02-27 |
Attorney, Agent or Firm:
NISHI, Kazuya et al. (JP)
West Kazuya (JP)
West Kazuya (JP)
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