Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LASER DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/124004
Kind Code:
A1
Abstract:
This laser device according to an embodiment of the present disclosure is provided with: a light source that oscillates a laser beam; and a reflective polarizing element that has a transmission axis aligned with the polarization direction of the laser beam and that is disposed on an optical path of the laser beam.

Inventors:
HOSHI MITSUNARI (JP)
Application Number:
JP2018/043693
Publication Date:
June 27, 2019
Filing Date:
November 28, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SONY CORP (Postcode1080075, JP)
International Classes:
B23K26/064; B23K26/00; B41J2/475; G02B5/30; H01S3/00; H01S3/10
Foreign References:
JP2001314991A2001-11-13
JPH079181A1995-01-13
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (Postcode1600022, JP)
Download PDF: