Title:
LASER DEVICE, LASER PROCESSING SYSTEM, AND LASER PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/170892
Kind Code:
A1
Abstract:
A laser device according to one aspect of the present disclosure is used in a laser processing system for performing laser processing by irradiating a workpiece with laser light in a gas including oxygen, the laser device comprising: a solid-state oscillator including a solid-state laser device that outputs laser light having a pulse width within the range of 100 ps to 1 ns and a center wavelength obtained by removing an oxygen absorption line in the oscillation wavelength range of an ArF excimer laser device; an ArF excimer amplifier that amplifies the laser light output from the solid-state oscillator; and a first optical pulse stretcher that outputs burst-pulsed laser light by dividing the laser light amplified by the ArF excimer amplifier into a plurality of pulses by causing the laser light to circulate through a delay optical path.
Inventors:
ONOSE TAKASHI (JP)
KAMBA YASUHIRO (JP)
IGARASHI HIRONORI (JP)
KAMBA YASUHIRO (JP)
IGARASHI HIRONORI (JP)
Application Number:
PCT/JP2022/010729
Publication Date:
September 14, 2023
Filing Date:
March 10, 2022
Export Citation:
Assignee:
GIGAPHOTON INC (JP)
International Classes:
B23K26/00; B23K26/064; H01S3/00; H01S3/10
Domestic Patent References:
| WO2020160415A1 | 2020-08-06 | |||
| WO2018100638A1 | 2018-06-07 | |||
| WO2018105082A1 | 2018-06-14 |
Foreign References:
| US20080240171A1 | 2008-10-02 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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