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Patent Searching and Data


Title:
LASER DEVICE AND LASER PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/198215
Kind Code:
A1
Abstract:
This laser device (1) is characterized by being provided with laser modules (20-1, 20-2, 20-3) that can oscillate laser beams; a housing (10) in which the laser modules (20-1, 20-2, 20-3) are embedded; and an expansion unit that is provided inside the housing (10) and is capable of storing an expansion laser module (20-4) which is connected in parallel with the laser modules (20-1, 20-2, 20-3).

Inventors:
KYOTO, Tomohiro (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
OGITA, Taira (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
MORIMOTO, Takeshi (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
MACHII, Hideyasu (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
KUROKAWA, Hiroaki (7-3 Marunouchi 2-chome, Chiyoda-k, Tokyo 10, 〒1008310, JP)
Application Number:
JP2018/015449
Publication Date:
October 17, 2019
Filing Date:
April 12, 2018
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORPORATION (7-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 10, 〒1008310, JP)
International Classes:
H01S3/00
Domestic Patent References:
WO2014065360A12014-05-01
WO2012036664A12012-03-22
Foreign References:
JP2007190566A2007-08-02
JP6261810B12018-01-17
JP2016081993A2016-05-16
Attorney, Agent or Firm:
TAKAMURA, Jun (Sakai International Patent Office, Toranomon Mitsui Building 8-1, Kasumigaseki 3-chome, Chiyoda-k, Tokyo 13, 〒1000013, JP)
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