Title:
LASER DICING ASSISTANCE SHEET
Document Type and Number:
WIPO Patent Application WO/2018/066229
Kind Code:
A1
Abstract:
Provided is a laser dicing assistance sheet with which chips can be prevented from coming loose during full-cut dicing by laser light irradiation can be prevented. The laser dicing assistance sheet comprises an adhesive layer formed from an adhesive composition. The adhesive layer is characterized by being adjusted such that the residual weight (as measured under a flow of nitrogen (50 ml/min) at a heating rate of 10°C/min) of the constituent material (adhesive composition) at 500°C is not more than 5.5%.
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Inventors:
NOZAWA KAZUHIRO (JP)
Application Number:
PCT/JP2017/028991
Publication Date:
April 12, 2018
Filing Date:
August 09, 2017
Export Citation:
Assignee:
KIMOTO KK (JP)
International Classes:
H01L21/301; B23K26/38; B23K26/70; C09J11/06; C09J133/06
Domestic Patent References:
| WO2010060038A1 | 2010-05-27 | |||
| WO2010147103A1 | 2010-12-23 |
Foreign References:
| JPS62121781A | 1987-06-03 | |||
| JP2005033170A | 2005-02-03 | |||
| JP2004079746A | 2004-03-11 | |||
| JP2016119432A | 2016-06-30 |
Other References:
See also references of EP 3524652A4
Attorney, Agent or Firm:
OHKURA, Koichiro (JP)
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