LASER DICING DEVICE AND DICING METHOD

WIPO Patent Application WO/2015/137004

A1

A laser dicing device (10) equipped with: a laser light source (21) that emits processing laser light (L1); an AF light source (31) that emits AF laser light (L2) which shares a portion of the light path of the processing laser light (L1); a collecting lens (24) arranged in the shared light path of the first and second laser lights (L1, L2); an AF signal processing unit (40) that generates a focus error signal on the basis of the AF laser light (L2) reflected by the surface of a wafer; a control unit (50) that, on the basis of the focus error signal, moves the collecting lens (24) in the wafer thickness direction so as to achieve a constant distance between the collecting lens (24) and the wafer surface; and a focus lens group (37) that adjusts the focal point position of the AF laser light (L2) in the wafer thickness direction while the focal point position of the processing laser light (L1) is fixed. Thus, it is possible to provide a laser dicing device and a laser dicing method which have a high degree of freedom with respect to changes in the processing depth of a modified region, and with which a modified region can be formed with good precision in the interior of a wafer.

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HYAKUMURA KAZUSHI (JP)

PCT/JP2015/052711

September 17, 2015

January 30, 2015

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TOKYO SEIMITSU CO LTD (JP)

B23K26/53; B23K26/046; H01L21/301

WO2013126927A2

2013-08-29

JP2010052014A	2010-03-11
JP2008058077A	2008-03-13
JP2011205115A	2011-10-13
JP2009271289A	2009-11-19
JP2013004584A	2013-01-07
JP2013157452A	2013-08-15

MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)

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