Title:
LASER DICING SHEET AND METHOD FOR MANUFACTURING CHIP BODY
Document Type and Number:
WIPO Patent Application WO/2008/069088
Kind Code:
A1
Abstract:
The present invention aims to prevent cutting of a dicing sheet, damage to a chuck table
and fusion bonding of a dicing sheet to a chuck table by laser light during laser
dicing. Specifically disclosed is a laser dicing sheet which is characterized by
being composed of a base made of a polyurethane acrylate and an adhesive layer formed
on one side of the base.
Inventors:
WAKAYAMA YOJI (JP)
SATO YOSUKE (JP)
TAYA NAOKI (JP)
SATO YOSUKE (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2007/073030
Publication Date:
June 12, 2008
Filing Date:
November 29, 2007
Export Citation:
Assignee:
LINTEC CORP (JP)
WAKAYAMA YOJI (JP)
SATO YOSUKE (JP)
TAYA NAOKI (JP)
WAKAYAMA YOJI (JP)
SATO YOSUKE (JP)
TAYA NAOKI (JP)
International Classes:
H01L21/301; C09J7/25; C09J201/00
Foreign References:
| JP2006192474A | 2006-07-27 | |||
| JP2002141306A | 2002-05-17 | |||
| JP2001207140A | 2001-07-31 | |||
| JP2006093368A | 2006-04-06 | |||
| JP2002343747A | 2002-11-29 | |||
| JP2006245487A | 2006-09-14 | |||
| JP2002141306A | 2002-05-17 |
Other References:
See also references of EP 2091073A4
Attorney, Agent or Firm:
MAEDA, Hitoshi et al. (2F Tokyodo Jinboucho 3rd Bldg.,1-17, Kandajinboucho 1-chom, Chiyoda-ku Tokyo 51, JP)
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