Title:
LASER DIODE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/119768
Kind Code:
A1
Abstract:
A laser diode device (100) comprises: a substrate (10); a pedestal (16); a laser diode chip (20); and a cover (30). The substrate has a base material (11) that includes a first main surface (11a) and a second main surface (11b) opposite to the first main surface, and a first conductor pattern (12) disposed on the first main surface. The first main surface includes an annular outer circumferential region (11aa). The first conductor pattern includes a terminal (12a) located inside the outer circumferential region in a plan view. The pedestal is disposed on the terminal and formed by a conductor. The laser diode chip is disposed on the pedestal. The laser diode chip has a light-emitting surface (20d) that emits a laser beam toward the outside of the substrate in the plan view. The cover has a side wall (31) and is fitted at the lower end of the side wall to the outer circumferential region.
Inventors:
SHINODA AKITO (JP)
Application Number:
PCT/JP2022/035406
Publication Date:
June 29, 2023
Filing Date:
September 22, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01S5/02325; H01S5/02208; H01S5/02257; H01S5/02315; H01S5/02355; H01S5/042
Domestic Patent References:
| WO2018030486A1 | 2018-02-15 |
Foreign References:
| JP2018529232A | 2018-10-04 | |||
| JP2021136290A | 2021-09-13 | |||
| JP2021518666A | 2021-08-02 | |||
| US20210075186A1 | 2021-03-11 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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