LASER DIODE PACKAGE MODULE, DISTANCE DETECTION APPARATUS, AND ELECTRONIC DEVICE

Title:

LASER DIODE PACKAGE MODULE, DISTANCE DETECTION APPARATUS, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/024240

Kind Code:

A1

Abstract:

A laser diode package module, a distance detection apparatus, and an electronic device. Said package module comprises: a substrate having a first surface; a cover provided on the first surface of the substrate, an accommodating space being formed between the substrate and the cover, a light transmitting region being at least partially provided on the surface of the cover opposite to the substrate; a laser diode chip provided in the accommodating space; and a reflective surface provided in the accommodating space, the reflective surface being used for allowing the emitted light of the laser diode chip to be reflected by the reflective surface and then emitted through the light transmitting region. According to the packaging solution of the present invention, the reflective surface is provided on the propagation path of the emitted light of the laser diode chip, so as to reflect the emitted light and then emit same from the light transmitting region on the cover, thereby changing propagation direction of the light beam.

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Inventors:

LIU XIANG (CN)
ZHENG GUOGUANG (CN)
HONG XIAOPING (CN)
WANG MINGYU (CN)
DONG SHUAI (CN)

Application Number:

PCT/CN2018/098418

Publication Date:

February 06, 2020

Filing Date:

August 03, 2018

Export Citation:

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Assignee:

SZ DJI TECHNOLOGY CO LTD (CN)

International Classes:

H01L33/60; H01L33/52; H01L33/58

Foreign References:

US20130264946A1	2013-10-10
US20130264946A1	2013-10-10
US20130264946A1	2013-10-10
CN103872230A	2014-06-18
JP2000151009A	2000-05-30
CN106469660A	2017-03-01

Other References: