LASER-ETCHED GRAIN-ORIENTED SILICON STEEL RESISTANT TO STRESS RELIEF/ANNEALING AND MANUFACTURING METHOD THEREFOR

Title:

LASER-ETCHED GRAIN-ORIENTED SILICON STEEL RESISTANT TO STRESS RELIEF/ANNEALING AND MANUFACTURING METHOD THEREFOR

Document Type and Number:

WIPO Patent Application WO/2018/177007

Kind Code:

A1

Abstract:

A laser-etched grain-oriented silicon steel resistant to stress relief/annealing and a manufacturing method therefor. Parallel line-shaped grooves (20) are formed on one or both sides of grain-oriented silicon steel (10) by laser etching. The line-shaped grooves (20) are perpendicular to, or at an angle to, a rolling direction of a steel plate. A maximum height of edge protrusions of the line-shaped grooves (20) does not exceed 5 μm, and a maximum height of spatter in etch-free regions between adjacent line-shaped grooves (20) does not exceed 5 μm, and the proportion of an area occupied by spatter in the vicinity of the line-shaped grooves (20) does not exceed 5%. The steel has low manufacturing costs, and the product etching effect is retained during a stress relief/annealing process, suitable for manufacturing of wound core transformers.

Inventors:

ZHAO ZIPENG (CN)
LI GUOBAO (CN)
YANG YONGJIE (CN)
WU MEIHONG (CN)
MA CHANGSONG (CN)
JI YAMING (CN)
LING CHEN (CN)
XIE WEIYONG (CN)
GUO JIANGUO (CN)

Application Number:

PCT/CN2018/074023

Publication Date:

October 04, 2018

Filing Date:

January 24, 2018

Export Citation:

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Assignee:

BAOSHAN IRON & STEEL (CN)

International Classes:

C21D8/12

Foreign References:

CN106282512A	2017-01-04
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CN105463172A	2016-04-06
JP2003129135A	2003-05-08
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US20130139932A1	2013-06-06
US7442260B2	2008-10-28
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Other References: