LASER LIFT-OFF APPARATUS

WIPO Patent Application WO/2012/017565

A1

The present invention makes it possible to perform laser lift-off processing in a short time without generating cracks in a material layer formed on a substrate. In order to remove a material layer (2) from a substrate (1) at the interface between the substrate and the material layer, a laser beam is applied to a work (3) from the substrate (1) side through a mask (44), said work having the material layer (2) formed on the substrate (1). The laser beam is split into a plurality of small-area laser beams by means of the mask (44), and a plurality of irradiation regions are formed on the work, said irradiation regions being spaced apart from each other. The adjacent irradiation regions are spaced apart from each other, irradiation region edges and adjacent irradiation region edges extending in the direction parallel to the relative moving direction of the work are arranged such that the irradiation region edges and the adjacent irradiation region edges are sequentially superimposed as the work moves, and each of the irradiation region edges is superimposed on the adjacent irradiation region edge. Consequently, the material layer can be reliably removed from the substrate without generating cracks in the material layer formed on the substrate.

MATSUDA RYOZO (JP)
NARUMI KEIJI (JP)

PCT/JP2010/066793

February 09, 2012

September 28, 2010

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USHIO ELECTRIC INC (JP)
MATSUDA RYOZO (JP)
NARUMI KEIJI (JP)

H01L21/268; H01L21/02; H01L21/20

JP2003282441A	2003-10-03
JP2003168820A	2003-06-13
JP2007149988A	2007-06-14
JP2007534164A	2007-11-22
JP2001501778A	2001-02-06

NAGASAWA Shunichirou (JP)
Shunichiro Nagasawa (JP)

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