Title:
LASER MACHINING APPARATUS, LASER MACHINING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER
Document Type and Number:
WIPO Patent Application WO/2022/014104
Kind Code:
A1
Abstract:
Provided is a laser machining apparatus provided with: a light source for outputting laser light; a space light modulator for modulating the laser light output from the light source in accordance with a modulation pattern and outputting the modulated laser light; a collecting lens for collecting the laser light output from the space light modulator to a subject, and forming a collecting spot on the subject; a movement unit for moving the collecting spot relatively to the subject; and a control unit for relatively moving, while setting a position of the collecting spot in a Z direction intersecting with an incident plane of the laser light on the subject to a first Z position by controlling at least the space light modulator and the movement unit, the collecting spot along a line extended in an X direction along the incident plane, thereby performing a first forming process for forming a first reformed area and a first crack extended from the first reformed area on the subject.
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Inventors:
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/013398
Publication Date:
January 20, 2022
Filing Date:
March 29, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/073; B23K26/067; B23K26/53; H01L21/301
Domestic Patent References:
| WO2020090905A1 | 2020-05-07 | |||
| WO2012014720A1 | 2012-02-02 |
Foreign References:
| JP2013089714A | 2013-05-13 | |||
| JP2014138956A | 2014-07-31 | |||
| JP2014017433A | 2014-01-30 | |||
| JP2020069531A | 2020-05-07 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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