Title:
LASER MACHINING APPARATUS AND LASER MACHINING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2019/077720
Kind Code:
A1
Abstract:
A laser machining apparatus (1) has: a machining head (22) having a sensor (23); and a control unit (10), to which a signal transmitted from the sensor (23) is inputted. On the basis of the signal, the control unit (10) determines whether drive shaft (24) adjustment relating to the machining head (22) is needed, and in the cases where the drive shaft (24) adjustment is needed, the control unit notifies a display unit (30) that the drive shaft (24) adjustment is needed, and, in a step separated from a laser machining step, the control unit compares data of the signal transmitted from the sensor (23) and previously stored data of a normal time with each other, and performs the drive shaft (24) adjustment relating to the machining head (22).
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Inventors:
KOSHIMAE TOSHIKI (JP)
MUKAE TOMONORI (JP)
UEMATSU MASAYUKI (JP)
MURAOKA HIROKI (JP)
MUKAE TOMONORI (JP)
UEMATSU MASAYUKI (JP)
MURAOKA HIROKI (JP)
Application Number:
PCT/JP2017/037859
Publication Date:
April 25, 2019
Filing Date:
October 19, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/00; B23K26/08
Foreign References:
| JP2013086172A | 2013-05-13 | |||
| JP2016147282A | 2016-08-18 | |||
| JPH1019535A | 1998-01-23 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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