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Patent Searching and Data


Title:
LASER MACHINING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/097864
Kind Code:
A1
Abstract:
The present invention addresses the problem of suppressing generation of machining marks by laser beams on a placement table while easily ensuring flatness of a placement table. Specifically, the present invention provides a laser machining apparatus that performs pattern processing of a thin film on a transparent substrate by use of laser beam irradiation. The laser machining apparatus is characterized by being provided with a laser beam irradiation part, and a placement table which comprises a top plate and a base plate and on which the transparent substrate is placed, wherein: the top plate is formed from a member for transmitting laser beams emitted from the laser beam irradiation part and has a transparent substrate suction path for performing vacuum sucking on the transparent substrate; and the base plate has a top plate supporting part that supports the top plate, an opening recessed from the surface, and a top plate suction path connected to the opening.

Inventors:
WADA HIROMITSU (JP)
MURAO KOICHI (JP)
Application Number:
JP2018/036723
Publication Date:
May 23, 2019
Filing Date:
October 01, 2018
Export Citation:
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Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B23K26/00; B23K26/40
Foreign References:
JPH06326337A1994-11-25
JP2013191712A2013-09-26
JP2013004926A2013-01-07
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