Title:
LASER MACHINING DEVICE, LASEER MACHINING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/116932
Kind Code:
A1
Abstract:
A laser machining device (1) equipped with: a holding unit (10) configured so as to be able to hold an object (2) being machined; a head unit (50); a first nozzle (54); and a drive unit (29). The head unit (50) is configured so as to able to irradiate a first portion (82) of a main surface (3) of the object (2) being machined with laser light (62). The first nozzle (54) is configured so as to be able to supply a first liquid (73) to the first portion (82). The drive unit (29) is configured so as to be able to drive the holding unit (10) so as to move the object (2) being machined circularly around the center of the optical axis (25) of the laser light (62) in the first portion (82). Therefore, it is possible to machine the object (2) being machined efficiently, and to prevent debris from the object (2) being machined from adhering to the main surface (3) of the object (2) being machined.
Inventors:
FUKUNAGA KEIGO (JP)
MATSUMURA TAMIO (JP)
MATSUMURA TAMIO (JP)
Application Number:
PCT/JP2017/044721
Publication Date:
June 28, 2018
Filing Date:
December 13, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/122; B23K26/142; H01L21/301
Foreign References:
| JP2014113604A | 2014-06-26 | |||
| JP2002263873A | 2002-09-17 | |||
| JPH01202387A | 1989-08-15 | |||
| JP2001130921A | 2001-05-15 | |||
| JP2007222897A | 2007-09-06 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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