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Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/018989
Kind Code:
A1
Abstract:
In order to improve the controllability of modified spots, a laser machining device (100) is provided with a first laser beam source (101) which emits a first pulsed laser beam (L1), a second laser beam source (102) which emits a second pulsed laser beam (L2), 1/2 wavelength plates (104, 105) which change the polarization directions of the respective pulsed laser beams (L1, L2), polarizing beam splitters (106, 107) which polarize and split the respective pulsed laser beams (L1, L2), the polarization directions of which have been changed, and a condenser lens (112) which converges the polarized and split pulsed laser beams (L1, L2) onto an object (1) to be machined. In the laser machining device (100), when the polarization directions of the pulsed laser beams (L1, L2) which are changed by the 1/2 wavelength plates (104, 105) are varied by a light intensity control unit (121), the ratio of the pulsed laser beams (L1, L2) which are polarized and split by the polarizing beam splitters (106, 107) is varied, and thus, the intensity of each of the pulsed laser beams (L1, L2) is adjusted.

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Inventors:
FUKUMITSU Kenshi (1126-1 Ichino-cho, Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
Application Number:
JP2010/063352
Publication Date:
February 17, 2011
Filing Date:
August 06, 2010
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS K.K. (1126-1, Ichino-cho Higashi-ku, Hamamatsu-sh, Shizuoka 58, 〒4358558, JP)
浜松ホトニクス株式会社 (〒58 静岡県浜松市東区市野町１１２６番地の１ Shizuoka, 〒4358558, JP)
International Classes:
B23K26/00; B23K26/06; B23K26/067; B23K26/38; B23K26/40; B28D5/00; C03B33/09
Attorney, Agent or Firm:
HASEGAWA, Yoshiki et al. (SOEI PATENT AND LAW FIRM, Marunouchi MY PLAZA 9th fl.1-1, Marunouchi 2-chom, Chiyoda-ku Tokyo 05, 〒1000005, JP)
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