Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2014/156688
Kind Code:
A1
Abstract:
A laser machining device provided with a laser light source for emitting laser light (L), a spatial light modulator (203) for modulating the laser light (L) emitted by the laser light source, and a light-condensing optical system (204) for condensing on a machining target (1) the laser light modulated by the spatial light modulator (203). The spatial light modulator (203) displays an axicon lens pattern as a modulation pattern when modified regions (7) are formed in a glass portion, whereby the laser light (L) is condensed on the machining target (1) in which a silicon-containing silicon portion is laminated via a resin portion on a glass-containing glass portion for condensing the laser light on the glass portion so that condensation points are formed in multiple positions aligned in proximity along the direction of irradiation of the laser light. The modified regions (7) are thereby formed in the interior of the machining target (1) along a planned cutting line (5), whereby machining quality is improved.
Inventors:
KAWAGUCHI DAISUKE (JP)
HIROSE TSUBASA (JP)
ARAKI KEISUKE (JP)
HIROSE TSUBASA (JP)
ARAKI KEISUKE (JP)
Application Number:
PCT/JP2014/056724
Publication Date:
October 02, 2014
Filing Date:
March 13, 2014
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; B23K26/06; B23K26/064; B23K26/40; H01L21/301
Foreign References:
| US20100025387A1 | 2010-02-04 | |||
| JP2011002698A | 2011-01-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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