Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/030039
Kind Code:
A1
Abstract:
A laser machining device comprising: a support platform that supports an object to be machined that includes a substrate comprising a crystal material; a laser light source that emits laser light; a light-concentrating optical system that concentrates laser light on the object to be machined supported on the support platform; an imaging unit that captures images of the surface of the object to be machined supported on the support platform; a candidate line setting unit that sets, for the object to be machined, a plurality of candidate lines that each extend in different directions; an operation control unit that controls the operation of at least one out of the support platform, the laser light source, and the light-concentrating optical system such that a modified area is formed inside the substrate and cracks reach from the modified area to the surface of the object to be machined, along each of the plurality of candidate lines; and a reference line setting unit that sets, for the object to be machined, a reference line determined as a line indicating the crystal orientation of the substrate on the basis of an image of the cracks captured by the imaging unit.
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Inventors:
OKUMA JUNJI (JP)
SUGIMOTO YO (JP)
SUGIMOTO YO (JP)
Application Number:
PCT/JP2016/073343
Publication Date:
February 23, 2017
Filing Date:
August 08, 2016
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L21/301; B23K26/00; B23K26/53
Foreign References:
| JP2014087833A | 2014-05-15 | |||
| JP2015062923A | 2015-04-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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