Title:
LASER MACHINING DEVICE AND LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/181063
Kind Code:
A1
Abstract:
Provided are a laser machining device and a laser machining method that make it possible to stably execute an autofocus function without the occurrence of undesirable phenomena such as overshoot. In this laser machining device and laser machining method, normal AF control is performed when the scan position of machining laser light and detection laser light is at a workpiece center part, and reduced-follow AF control, in which displacement of a main surface of a workpiece is followed less than in normal AF control, is performed when the scan position of the machining laser light and the detection laser light is at a workpiece end part.
Inventors:
SHIONOYA TAKAO (JP)
Application Number:
PCT/JP2018/042540
Publication Date:
September 26, 2019
Filing Date:
November 16, 2018
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
International Classes:
B23K26/046
Foreign References:
| JP2008093724A | 2008-04-24 | |||
| JP2008200745A | 2008-09-04 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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