LASER MACHINING DEVICE

WIPO Patent Application WO/2015/118829

A1

　A laser machining device has a laser oscillation device (2), an acoustic optical element (3), a first measuring instrument (6), a machining section (5), and a control unit (7). The laser oscillation device (2) outputs an output beam (B0). The acoustic optical element (3), which is irradiated by the output beam (B0), selectively emits the output beam (B0) in either a first optical path (R1) or a second optical path (R2). The first measuring instrument (6), which is provided in the first optical path (R1), measures the energy of a machining beam (B2). The machining section (5) is provided in the second optical path (R2). The control unit (7) controls the laser oscillation device (2) and the acoustic optical element (3), and receives a first measured value measured by the first measuring instrument (6). The output beam (B0) emitted in the first optical path (R1) is radiated from the acoustic optical element (3) directly onto the first measuring instrument (6). The control unit (7) detects abnormalities in the machining beam (B2) on the basis of the first measured value.

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HIRAMOTO TADAHIRO
UCHIKATA AKIMASA
NISHIHARA MANABU
MURAKOSHI TOSHIICHI
SASAKI YOSHINORI
FUNAI KOHEI

PCT/JP2015/000311

August 13, 2015

January 26, 2015

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PANASONIC IP MAN CO LTD (JP)

B23K26/00; B23K26/064; B23K26/067; H01S3/00

JP2003136267A	2003-05-14
JP2004025292A	2004-01-29
JP2013239572A	2013-11-28
JP2009142867A	2009-07-02
US20110180521A1	2011-07-28
US20060013532A1	2006-01-19

FUJII, Kentaro et al. (JP)
Fujii Kentaro (JP)

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