Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/058522
Kind Code:
A1
Abstract:
This laser machining device is provided with: a laser oscillator (2) that oscillates laser light (3), i.e., pulse laser light; and an infrared sensor (21) that is an optical detector, which receives the pulse laser light, and outputs a detection signal. The laser machining device is also provided with: a first integration circuit (23) that integrates the detection signal when the pulse laser light is turned on while the laser oscillator (2) is operating; and a second integration circuit (24) that integrates the detection signal when the pulse laser light is turned off while the laser oscillator (2) is operating.
Inventors:
ITO KAZUYUKI (JP)
IKEMI ATSUSHI (JP)
IKEMI ATSUSHI (JP)
Application Number:
PCT/JP2017/034344
Publication Date:
March 28, 2019
Filing Date:
September 22, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
B23K26/00
Domestic Patent References:
| WO2013171848A1 | 2013-11-21 |
Foreign References:
| JPH11287707A | 1999-10-19 | |||
| JPS62227587A | 1987-10-06 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
Download PDF: