Title:
LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/078092
Kind Code:
A1
Abstract:
This laser machining device (100) for condensing a laser beam on a machining object and performing laser machining is characterized by being provided with a condensing optical system (3) for condensing a laser beam, the condensing optical system (3) having aberration, and the lateral aberration in the laser beam prior to condensing thereof, at a light condensing point for light rays corresponding to D85.5, which is the laser beam diameter containing 86.5% of the laser power, being 0.2 mm or greater.
Inventors:
KUBA KAZUKI (JP)
UENO AKIHIRO (JP)
EGUCHI TOSHINOBU (JP)
YOSHIDA MASARU (JP)
MIYATA JUNJI (JP)
UENO AKIHIRO (JP)
EGUCHI TOSHINOBU (JP)
YOSHIDA MASARU (JP)
MIYATA JUNJI (JP)
Application Number:
PCT/JP2018/037981
Publication Date:
April 25, 2019
Filing Date:
October 11, 2018
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
TADA ELECTRIC CO LTD (JP)
TADA ELECTRIC CO LTD (JP)
International Classes:
G02B13/00; B23K26/064; B23K26/073
Foreign References:
| JP2005169395A | 2005-06-30 | |||
| JP2003088984A | 2003-03-25 | |||
| JPH0985481A | 1997-03-31 | |||
| JPH09220690A | 1997-08-26 |
Attorney, Agent or Firm:
TAKAMURA, Jun (JP)
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