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Patent Searching and Data


Title:
LASER MACHINING HEAD, AND LASER MACHINING SYSTEM COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/209930
Kind Code:
A1
Abstract:
A laser machining head (10) has a housing (11), and a plurality of optical components. The housing (11) has first and second light incident openings (12a), (12b) through which first and second laser lights (A), (B) are incident, respectively, and a light emission opening (13). The second laser light (B) has a wavelength different from that of the first laser light (A). The plurality of optical components include a bend mirror (30), a dichroic mirror (40), an aperture (71), and a detection-side condenser lens (70). The first and second laser lights (A), (B) that have passed through the detection-side condenser lens (70) are received by an image sensor (60). The aperture (71) is configured to be able to decrease the diameters of the first and second laser lights (A), (B) incident on the detection-side condenser lens (70).

Inventors:
OGUCHI HISAYUKI
TAKAHASHI WATARU
Application Number:
PCT/JP2022/012128
Publication Date:
October 06, 2022
Filing Date:
March 17, 2022
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B23K26/064; B23K26/066
Domestic Patent References:
WO2018097018A12018-05-31
Foreign References:
JP2001018086A2001-01-23
JPH10296468A1998-11-10
JP2009226473A2009-10-08
JP2014226473A2014-12-08
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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