Title:
LASER MACHINING METHOD AND LASER MACHINING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/039162
Kind Code:
A1
Abstract:
In the present invention, when forming modified spots in a workpiece with said spots exposed to the surface upon which laser light is incident, the aberration of said laser light is corrected such that the focal point of the laser light is located inside the workpiece and near the laser-light incidence surface thereof, preventing the laser light from failing to form modified spots and making it possible to form the modified spots in the workpiece with high precision. Laser light (L) is focused inside the workpiece (1) so as to form a modified region (7) containing modified spots (S) in said workpiece (1). Laser light (L) is also focused on the laser-light incidence surface (3) of the workpiece (1) with the aberration of said laser light (L) corrected such that the focal point of the laser light (L) is located inside the workpiece (1) and near the laser-light incidence surface (3), thereby forming second modified spots (S2) exposed to the surface (3) of the workpiece (1).
Inventors:
KAWAGUCHI DAISUKE (JP)
Application Number:
PCT/JP2012/073499
Publication Date:
March 21, 2013
Filing Date:
September 13, 2012
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
KAWAGUCHI DAISUKE (JP)
KAWAGUCHI DAISUKE (JP)
International Classes:
B23K26/04; B23K26/00; B23K26/38; B23K26/40; B28D5/00
Domestic Patent References:
| WO2010098186A1 | 2010-09-02 |
Foreign References:
| JP2010000542A | 2010-01-07 | |||
| JP2011131256A | 2011-07-07 | |||
| JP2005288503A | 2005-10-20 | |||
| JP2007260749A | 2007-10-11 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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