Title:
LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2006/101091
Kind Code:
A1
Abstract:
A laser machining method in which chipping can be reduced when a planar workpiece having a modified region is segmented in a step other than its segmentation step. At a portion (50) of a workpiece (1) along a cutting line, a laser beam is produced by to pulse oscillation for an intermediate portion (51) including an effective portion (41), and a laser beam is oscillated continuously for one end portion (52) and the other end portion (53) on both sides of the intermediate portion (51). Since the intensity of the laser beam oscillated continuously is lower than the intensity of the laser beam produced by pulse oscillation, modified regions (71, 72, 73) can be formed in the intermediate portion (51) while preventing formation thereof in the one end portion (52) and the other end portion (53). Since the modified regions (71, 72, 73) do not reach the outer surface of a substrate (4), production of particles can be prevented when the modified regions (71, 72, 73) is formed.
Inventors:
KUNO KOJI (JP)
SUZUKI TATSUYA (JP)
SUZUKI TATSUYA (JP)
Application Number:
PCT/JP2006/305594
Publication Date:
September 28, 2006
Filing Date:
March 20, 2006
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
KUNO KOJI (JP)
SUZUKI TATSUYA (JP)
KUNO KOJI (JP)
SUZUKI TATSUYA (JP)
International Classes:
B28D5/00; B23K26/40; H01L21/301
Domestic Patent References:
| WO2002022301A1 | 2002-03-21 | |||
| WO2003076118A1 | 2003-09-18 |
Foreign References:
| JP2002075919A | 2002-03-15 | |||
| JP2002043254A | 2002-02-08 |
Other References:
See also references of EP 1867427A4
None
None
Attorney, Agent or Firm:
Hasegawa, Yoshiki (Ginza First Bldg. 10-6 Ginza 1-chom, Chuo-ku Tokyo 61, JP)
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