Title:
LASER MACHINING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/039006
Kind Code:
A1
Abstract:
In the present invention, laser light (L) is focused onto a quartz-crystal workpiece (1) such that a modified region (7) containing a plurality of modified spots (S) is formed in the workpiece (1) along a planned-cut line (5). To do so, the workpiece (1) and/or the laser light (L) is moved so as to produce relative movement therebetween along the planned-cut line (5) as the laser light (L) is shined on the workpiece (1), thereby forming a plurality of modified spots (S1) inside the workpiece (1) along the planned-cut line (5). Then, the workpiece (1) and/or the laser light (L) is moved so as to produce relative movement therebetween along the planned-cut line (5) as the laser light (L) is shined on the workpiece (1), thereby forming a plurality of modified spots (S2) exposed at the surface (3) of the workpiece (1) along the planned-cut line (5) such that no cracks exposed to the surface (3) are formed.
Inventors:
KAWAGUCHI DAISUKE (JP)
Application Number:
PCT/JP2012/072930
Publication Date:
March 21, 2013
Filing Date:
September 07, 2012
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
KAWAGUCHI DAISUKE (JP)
KAWAGUCHI DAISUKE (JP)
International Classes:
B28D5/00; B23K26/04; B23K26/38; B23K26/40
Foreign References:
| JP2007284310A | 2007-11-01 | |||
| JP2009067612A | 2009-04-02 | |||
| JP2011051011A | 2011-03-17 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims: