Title:
LASER MACHINING SUCTION DEVICE AND LASER MACHINING APPARATUS COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2022/235003
Kind Code:
A1
Abstract:
The present invention relates to a laser machining suction device for suctioning process by-products caused by laser machining, and a laser machining apparatus comprising same, and the laser machining suction device may comprise: a hollow part for providing a laser passage toward a substrate; a suction path part separated from the hollow part such that the process by-products caused by laser machining flow therein; and a suction line communicating with the suction path part so that the process by-products having flowed into the suction path part are discharged therethrough.
Inventors:
UM TAE JUN (KR)
KIM SUNG JIN (KR)
KIM BYUNG SU (KR)
KIM DAE YOU (KR)
KIM SUNG JIN (KR)
KIM BYUNG SU (KR)
KIM DAE YOU (KR)
Application Number:
PCT/KR2022/005972
Publication Date:
November 10, 2022
Filing Date:
April 27, 2022
Export Citation:
Assignee:
AP SYSTEMS INC (KR)
International Classes:
B23K26/16; B23K26/142; B23K26/70; B23K101/36
Foreign References:
| KR20180002958A | 2018-01-09 | |||
| CN106271054A | 2017-01-04 | |||
| KR20160056464A | 2016-05-20 | |||
| JP2017127884A | 2017-07-27 | |||
| KR20190024654A | 2019-03-08 |
Attorney, Agent or Firm:
AHN, Joon-Hyung et al. (KR)
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