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Patent Searching and Data


Title:
A LASER MACHINING SYSTEM AND METHOD
Document Type and Number:
WIPO Patent Application WO2002076666
Kind Code:
A3
Abstract:
A substrate (16) is machined to form, for example, a via. The substrate is in a chamber (15) within which the gaseous environment is controlled. The machining laser beam (13) is delivered with control of parameters such as pulsing parameters to achieve desired effects. The gaseous environment may be controlled to control integral development of an insulating lining for a via, thereby avoiding the need for downstream etching and oxide grwth steps. Also, machining may be performed in multiple passes in order to minimise thermal damage and to achieve other sedired effects such as a particular via geometry.

Inventors:
BOYLE ADRIAN (IE)
MEIGHAN OONAGH (IE)
WALSH GILLIAN (IE)
MAH KIA WOON (IE)
Application Number:
IE0200035W
Publication Date:
February 12, 2004
Filing Date:
March 22, 2002
Export Citation:
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Assignee:
XSIL TECHNOLOGY LIMITED
BOYLE, ADRIAN
MEIGHAN, OONAGH
WALSH, GILLIAN
MAH, KIA, WOON
International Classes:
B23K26/00; B23K26/06; B23K26/12; B23K26/14; B23K26/38; H01L21/302; H01L21/461; B23K101/40; H05K3/00; (IPC1-7): B23K26/12; B23K26/38
Domestic Patent References:
WO2000050198A12000-08-31
Foreign References:
EP0985484A22000-03-15
US3632398A1972-01-04
US5916460A1999-06-29
US4639572A1987-01-27
US5411918A1995-05-02
Other References:
PATENT ABSTRACTS OF JAPAN vol. 014, no. 291 (M - 0989) 22 June 1990 (1990-06-22)
PATENT ABSTRACTS OF JAPAN vol. 018, no. 239 (M - 1601) 9 May 1994 (1994-05-09)
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 06 4 June 2002 (2002-06-04)
PATENT ABSTRACTS OF JAPAN vol. 2002, no. 05 3 May 2002 (2002-05-03)
PATENT ABSTRACTS OF JAPAN vol. 010, no. 258 (C - 370) 4 September 1986 (1986-09-04)
"COMBINED LASER PROCESSING OF VIAS AND CIRCUITRY IN FLEX-CIRCUITS", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 38, no. 5, 1 May 1995 (1995-05-01), pages 607 - 608, XP000519699, ISSN: 0018-8689
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