Title:
LASER MARKING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/155954
Kind Code:
A1
Abstract:
Provided is an apparatus for performing laser marking at a desired positional accuracy even if a position detector of a relative movement part is formed from a material having a thermal expansion coefficient different from that of a workpiece, without using an expensive laser length measuring machine. Specifically, this laser marking apparatus is provided with: a workpiece holding part; a laser processing part; a relative movement part; a reference mark that, in a base section to which the workpiece holding part is mounted, is disposed outwards of the boundary of a workpiece and that is registered in association with relative positional information about a processing position by a laser beam applied toward the workpiece; a mark position detection part that performs relative movement integrally with the laser processing part and detects the position of the reference mark; a positional displacement amount calculation unit that calculates a positional displacement amount between the position of the reference mark detected by the mark position detection part and a detection reference position which is registered in advance and which is of the reference mark; and a beam application position correction unit that corrects the processing position by a laser beam on the basis of the positional displacement amount and the relative positional information.
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Inventors:
WADA HIROMITSU (JP)
MURAO KOICHI (JP)
MURAO KOICHI (JP)
Application Number:
PCT/JP2019/003154
Publication Date:
August 15, 2019
Filing Date:
January 30, 2019
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B23K26/02; B23K26/00
Foreign References:
| JPH06277864A | 1994-10-04 | |||
| JPH1133763A | 1999-02-09 | |||
| JP2001334376A | 2001-12-04 | |||
| JPH1058175A | 1998-03-03 | |||
| JP2005040843A | 2005-02-17 |
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