Title:
LASER MODULE
Document Type and Number:
WIPO Patent Application WO/2017/138649
Kind Code:
A1
Abstract:
To provide a laser module capable of minimizing the effects of reflected light between chips. A laser module 100 according to one embodiment of the present invention is provided with a laser element 110 that is arranged on a first substrate and has a laser oscillation unit that generates laser light and a first optical waveguide for guiding laser light, and an optical amplifier 120 that is arranged on a second substrate and has a second optical waveguide for guiding laser light, wherein the first optical waveguide is connected at an angle to an end face of the first substrate, the second optical waveguide is connected at an angle to an end face of the second substrate, and the first substrate and the second substrate are disposed such that the laser light output by the first optical waveguide optically couples with the second optical waveguide.
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Inventors:
ARIGA MAIKO (JP)
INABA YUSUKE (JP)
KIYOTA KAZUAKI (JP)
SUZUKI TOSHIHITO (JP)
INABA YUSUKE (JP)
KIYOTA KAZUAKI (JP)
SUZUKI TOSHIHITO (JP)
Application Number:
PCT/JP2017/004970
Publication Date:
August 17, 2017
Filing Date:
February 10, 2017
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
H01S5/022
Domestic Patent References:
| WO2013180291A1 | 2013-12-05 | |||
| WO2010143763A1 | 2010-12-16 |
Foreign References:
| JP2011211010A | 2011-10-20 | |||
| JP2001111177A | 2001-04-20 |
Attorney, Agent or Firm:
OKABE, Yuzuru et al. (JP)
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