Title:
LASER, PACKAGE STRUCTURE OF LASER ARRAY, AND PACKAGE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2019/195978
Kind Code:
A1
Abstract:
Provided are a laser, a package structure of a laser array, and a package assembly. The package structure of a laser comprises: a first substrate, a transmission line and a laser chip, wherein the transmission line and the laser chip are both disposed on the first substrate, and the transmission line is connected to an electrode of the laser chip by means of a first wire. In the technical solution provided in the present application, a laser chip and a signal line are located on the same horizontal plane, so that the length of a required first wire is shorter, and inductive parasitic parameters generated by the shorter wire are also smaller. Thus, a hindering effect of parasitic inductance on a high-frequency signal can be reduced, and increasing the transmission bandwidth of the laser chip is facilitated.
Inventors:
QUAN MINGRAN (CN)
CHEN WEI (CN)
SHEN HONGMING (CN)
SONG XIAOLU (CN)
CHEN WEI (CN)
SHEN HONGMING (CN)
SONG XIAOLU (CN)
Application Number:
PCT/CN2018/082305
Publication Date:
October 17, 2019
Filing Date:
April 09, 2018
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G02B6/42; H04B10/50
Foreign References:
| CN103969758A | 2014-08-06 | |||
| CN103969758A | 2014-08-06 | |||
| CN104734782A | 2015-06-24 | |||
| CN103022893A | 2013-04-03 |
Attorney, Agent or Firm:
LONGSUN LEAD IP LTD. (CN)
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